CuMn基钎料对TZM与Kovar合金的钎焊研究

Study on brazing TZM and Kovar alloy with CuMn base filler metal

摘要:

采用研制的CuMn基钎料对TZM与Kovar合金进行了高频真空钎焊研究。采用DTA、氦质谱捡漏仪、激光共聚焦显微镜、SEM、EDS等分析测试手段,测试了钎料的熔点、对TZM与Kovar合金润湿性,测试了钎缝的气密性、微观组织形貌、界面组织成份等。结果表明：在965℃时,CuMn基钎料在TZM与Kovar合金样品上的润湿角θ分别为30.77°和12.30°,在最大钎焊感应电流为430A时,焊料对钎缝铺展均匀,钎缝区域无裂纹、无气泡等缺陷,焊件气密性测试漏率优于6×10_^-11 Pa.m_³/s,钎缝中间层区域为CuMn基钎料凝固组织,钎料与TZM反应界面区域较窄,与Kovar合金的界面反应区域较宽,钎料中的Mn、Cu元素与Kovar合金中的Fe元素更容易相互扩散迁移发生冶金熔合反应。

Abstract:

The CuMn - based filler was used to brazing TZM and Kovar alloys.By means of DTA, helium mass spectrometer, laser confocal microscope, SEM and EDS,the melting point and wettability of TZM and Kovar alloys were tested and the gas tightness, microstructure, interfacial structure composition of the welds were also tested. The results show that: At 965 ℃, the wetting Angle of Cu-Mn base solder on TZM and Kovar alloy sample is 30.77 ° and 12.30 ° respectively. When the largest induced current is 430A, the solder spread out evenly on weld and the weld areas were without crack, without defects such as bubbles. The leakage rate test of welding are better thanS6×10^-11 Pa.m3/s. The middle area of the weld is CuMn metallurgical solidification organization, solder with TZM reaction interface area is relatively narrowd and with Kovar alloy interface reaction area is wider. Mn and Cu in the filler metal and Fe in Kovar alloy are more likely to diffuse and migrate to each other to form the metallurgical fusion reaction.