TC4钛合金局部感应加热刚性拘束热自压扩散连接与机理分析

Study on rigid restraint thermal self-compressing bonding of Ti6Al4V alloy by local induction heating

摘要:

提出了一种新型扩散连接方法——局部感应加热刚性拘束热自压扩散（TSCB）。利用TC4板材进行了实验，验证了局部感应加热刚性拘束热自压扩散方法的可行性。在实验基础上建立了感应加热刚性拘束热自压扩散过程热应力应变有限元分析模型，揭示了钛合金局部感应加热刚性拘束热自压扩散连接机理。实验结果表明，感应加热刚性拘束热自压扩散原理可行，接头显微组织均匀，综合力学性能较好。热应力应变过程有限元数值分析表明，在刚性拘束的待连接材料对接区域进行局部感应加热时，界面附近形成热拘束应力应变场，对界面处高温热塑性状态金属进行热挤压，促进界面两侧原子扩散，最终实现了固相连接。

Abstract:

Rigid restraint thermal self-compressing bonding (TSCB) by localized induction heating, a new diffusion bonding technology was proposed in this paper. Experiments were conducted on Ti6Al4V plates to prove the feasibility of rigid restraint thermal self-compressing bonding by local induction heating. Moreover, finite element analysis was employed to numerically investigate the thermal elastic-plastic stress-strain cycle during thermal self-compressing bonding by localized induction heating. Results show that solid-state joint with homogeneous microstructure and excellent mechanical properties was attained. By localized induction heating, an internal elasto-plastic stress-strain field is developed which makes the bond interface subjected to thermal compressive action. This thermal self-compressing action combined with the high temperature on the bond interface promotes the atom diffusion across the bond interface to produce solid-state joints.