Cu@Ag包覆粉体的SPS烧结及其致密机理研究

Study on SPS Sintering of Cu @ Ag Coated Powder and Its Dense Mechanism

摘要:

采用化学镀法制备Cu@Ag包覆粉体,并利用放电等离子烧结技术(SPS)对其进行烧结,利用扫描电子显微镜、透射电子显微镜研究包覆粉体、烧结样品的微观结构,对烧结样品的物相,致密度及其致密化机理进行表征与分析。结果表明,化学镀法制备的Cu@Ag粉体表面存在高纯的包覆层。在较低的烧结温度下得到致密度高的Cu-Ag烧结块体,温度升高,Cu-Ag烧结块体的致密度逐渐升高,550℃时,致密度达到极大值96.76%。分析认为,得益于Cu@Ag粉体的包覆结构,在低温下,铜颗粒表面的纳米银的颈缩促进了烧结；在高温下,Cu、Ag间的固溶进一步促进了烧结。

Abstract:

Cu@Ag coated powder was prepared by electroless plating and sintered by spark plasma sintering technology (SPS). The scanning electron microscope and transmission electron microscope were used to study the microstructure of the coated powder and sintered samples. The phases and densities of the samples were characterized. The results showed that there is obvious coating on the surface of Cu@Ag powder prepared by electroless plating. By using SPS, a high-density Cu-Ag sintered block can be obtained. At 550 ° C, the density reached a maximum of 96.76%. At low temperatures, the necking of nano-silver promotes the sintering; at high temperatures, solid solution between Cu and Ag promotes sintering.