粉末冶金W/Re合金靶材的显微结构及溅射沉积性能

Microstructure and magnetron sputtering properties of W/Re alloy targets fabricated by powder metallurgy

摘要:

为了研制高品质W/Re合金靶材,采用机械混料、压制成形和真空烧结致密化的工艺路线制备了纯钨及铼含量分别为1wt.%、5wt.%、10wt.%的钨/铼(W/Re)合金,测试了W/Re合金的致密度、晶粒度及晶粒取向、磁控溅射沉积等性能。研究表明,W/Re合金的致密度随Re含量增加而逐渐提高,其中W/10wt.%Re合金致密度达96.6%。W/10wt.%Re合金靶材纯度极高,EBSD图中W/10wt.%Re合金晶粒细小均匀,晶粒尺寸主要介于10μm～40μm之间,W/Re合金晶粒随机分布,并未出现明显的择优取向,且其中小角度晶界(<10°)达85%以上,非常适用于磁控溅射镀膜。随着磁控溅射沉积压力的提高,W/Re合金薄膜的晶粒尺寸逐渐细化,镀膜表面平整程度逐渐提高,薄膜的厚度呈逐渐增加的趋势。镀膜在40.5°、58.6°、73.5°附近出现分别属(110)、(200)和(211)晶面的衍射峰,且随着沉积压力升高,(110)晶面衍射峰逐渐减弱,而(200)晶面衍射峰则逐渐增强。

Abstract:

In order to development high quality W/Re alloy targets, pure W and W/Re alloy (with 1wt.%, 5wt.% and 10wt.% content of Re) was fabricated by mechanical mixing, press forming and vacuum sintering. Properties such as relative density, grain size and direction, magnetron sputtering of W/Re alloy were investigated. Relative density of W/Re alloy increased with content of Re addition. And relative density of W/10wt.%Re was high up to 96.6%. EPMA results showed that the purity of W/10wt.%Re alloy target was very high. And grain size of W/10wt.%Re alloy was mainly distributed between 10 μm and 40 μm. The grain size of W/Re alloy was randomly distributed without preferred orientation as shown in EBSD results. And content of small angle grain boundary (< 10 °) of W/10wt.%Re alloy was more than 85%. The grain size of W/Re alloy thin film was gradually refined as deposition pressure of magnetron sputtering increasing. Meanwhile, both surface flatness and thickness of thin film were gradually increased. XRD spectra of thin films showed that (110), (200) and (211) diffraction peaks appeared near 40.5 °, 58.6 ° and 73.5 °, respectively. As the deposition pressure increasing, the intensity of (110) diffraction peaks decreased gradually, while those of (200) diffraction peaks increased gradually.