超细球形银铜合金粉末的激光雾化制备工艺研究

Research on laser atomization processes for preparation of ultrafine spherical silver-copper alloy powders

摘要:

银铜合金粉末兼具银粉和铜粉的优势，在电子制造、催化和医疗领域有广泛的应用前景。采用脉冲激光刻蚀银铜共晶合金靶材方法制备了粉末样品，采用扫描电镜、X射线能谱仪和差热分析等测试手段研究了粉末样品的粒径、外貌、成分和微观组织。结果表明，脉冲激光刻蚀制备的银铜合金粉末的粒径集中分布范围为1 ~ 6 μm。粉末颗粒呈球形、表面光滑。粉末颗粒的平均银含量接近靶材，在剖面上成分均匀、含银量波动小于3 at%。粉末的微观组织为富银相和富铜相。粉末和靶材的开始熔化温度分别为773℃和779.5℃。两者熔化温度区间相近，但前者的温度区间相比后者向低温发生了偏移，推测是由于粉末颗粒中存在亚稳组织所导致的。研究结果为高性能超细球形银铜合金粉末的制备提供了一种可行途径。

Abstract:

AgCu alloy powder has both the advantages of Ag powder and Cu powder, and has broad application prospects in electronic manufacturing, catalysis and medical fields. Powder samples were prepared by pulse laser etching of AgCu eutectic alloy targets. The particle size, appearance, composition and microstructure of the powder samples were studied by scanning electron microscope, X-ray energy dispersive spectrometer and differential thermal analysis. The results show that the particle size distribution of AgCu alloy powder prepared by pulsed laser etching is in the range of 1 ~ 6 μm. The powder particles are spherical and have a smooth surface. The average Ag content of the powder particles is close to that of the target, the composition is uniform on the cross section, and the Ag content fluctuation is less than 3 at%. The microstructure of the powder is Ag-rich phase and Cu-rich phase. The onset melting temperatures of the powder and target were 773°C and 779.5°C, respectively. The melting temperature range of the two is similar, but the temperature range of the former is shifted to a lower temperature than the latter, which is presumed to result from the presence of metastable structures in the powder particles. The research results provide a feasible way for the preparation of high-performance ultrafine spherical AgCu alloy powders.