GH5188高温合金TLP接头等温凝固过程数值计算

Numerical Calculation of Isothermal Solidification Process of GH5188 High Temper-ature Alloy TLP Joints

摘要:

TLP焊接过程中一个重要的参数是完全等温凝固所需的时间,本研究选用自主研制的KCo10钴基中间层进行试验,在1030 ℃、1050 ℃和1080 ℃(1303 K、1323 K和1353 K)的温度下进行了不同保温时间的焊接。以共晶液相两侧的固溶体作为边界,测量平均ASZ尺寸。通过测量ASZ的尺寸随焊接时间的平方根变化的情况,采用数据拟合的方式得出ASZ尺寸与结合时间的线性关系,然后基于菲克第二定律的随时间变化的扩散方程建立等温凝固过程的数学模型,对等温凝固时间t_IS进行模拟求解,从而预测等温凝固所需时间,并经过实验验证了数学模型预测等温凝固时间的准确性。

Abstract:

An important parameter in the TLP welding process is the time required for complete isothermal solidification. In this study, KCo10 intermediate layer was mainly used for the tests, which were carried out at temperatures of 1030 ℃, 1050 ℃ and 1080 ℃ (1303 K, 1323 K and 1353 K) with different holding times. The average ASZ size was measured using the solid solution on both sides of the eutectic liquid phase as the boundary. By measuring the size of the ASZ with the square root of the variation of the welding time, data fitting was used to derive a linear relationship between the ASZ size and the bonding time, and then a mathematical model of the isothermal solidification process was established based on Fick"s second law of diffusion equation with time, and the isothermal solidification time tIS was simulated and solved so as to predict the approximate time required for isothermal solidification, and was experimentally verified The accuracy of the mathematical model in predicting the isothermal solidification time was verified experimentally.