银包铜粉制备与应用的研究进展

Research Progress on Preparation and Application of silver-coated copper powders

摘要:

银包铜粉是在铜表面包裹银的粉体材料,因其可替代银粉降低成本,在导电浆料等领域具有广阔的应用前景。本文介绍了银包铜粉的制备方法,包括机械球磨法、熔融雾化法和化学镀法,其中,化学镀法具有设备简单、成本较低的特点,已成为工业上应用最广泛的制备方法；重点阐述了化学镀法的原理及工艺,对比了置换法和还原法的异同。在此基础上,归纳总结了银包铜粉的包裹机理。此外,对银包铜粉在导电胶、电磁屏蔽涂料和导电油墨等领域的应用和研究进展进行了介绍,结合行业最新进展指出银包铜粉面临的技术挑战,亟需建立镀层厚度调控模型,来降低银含量的同时确保高抗氧化性。本综述可对银包铜粉制备及包裹机理的研究提供指导。

Abstract:

Silver-coated copper powder is a composite material in which silver is coated on the surface of copper. It has the potential to replace silver powder for making pastes, thus cost can be reduced. This paper describes the preparation methods of silver-coated copper powder, including mechanical ball milling, melt atomization and chemical plating. Chemical plating has the advantages of simple equipment and low cost, and has become the most widely used method in the industry. The principle and process of chemical plating are introduced, and the differences between displacement method and reduction method are compared. Futhermore, the coating mechanism of silver-coated copper powder is summarized. This paper also introduces the applications and progress of silver-coated copper powder in the fields of conductive adhesives, electromagnetic shielding coatings and conductive inks. The technical challenges of silver-coated copper powder are identified, the control model of thickness of coating layer is needed to decrease silver content while guarantee anti-oxidation. This review can provide guidance for the preparation method and give a deep understanding on the coating mechanism of silver-coated copper powder.