不同方法制备的AgSnO2TiB2 电接触材料的微观结构和电弧侵蚀行为

Microstructure and Arc Erosion Behavior of AgSnO2TiB2 Contact Material Prepared by Different Methods

摘要:

分别采用球磨法、可溶性淀粉模板法和滤纸模板法制备了AgSnO₂TiB₂复合粉末，并利用火花等离子体烧结技术（SPS）制备了块体材料。对Ag4%SnO₂4%TiB₂（质量分数）电接触材料的物理性能和电弧侵蚀特性进行了研究。结果表明，模板的空间限域效应有效地改善了增强相在基体中的均匀分散，提高了Ag4%SnO₂4%TiB₂接触材料的导电率和硬度。与球磨法相比，滤纸模板法和淀粉模板法制备的Ag4%SnO₂4%TiB₂复合材料的电导率分别增加了12.18倍和9.60倍， 显微硬度分别增加了17.10%和33.94%。滤纸模板更有利于SnO₂和TiB₂的均匀分散，减少集中电弧侵蚀和飞溅损失，因此具有更好的抗弧蚀性。

Abstract:

The AgSnO₂TiB₂ composite powders were synthesized by the ball milling, soluble starch template and filter paper template methods, and subsequently consolidated by spark plasma sintering (SPS). The physical properties and arc erosion behavior of Ag4wt%- SnO₂4wt%TiB₂ contact materials were investigated. The results reveal that the spatial domain-limiting effects of the template can remarkably improve the dispersion of the reinforcements in the Ag matrix, and then electrical conductivity and hardness of Ag4wt%-SnO₂4wt%TiB₂ contact materials are increased. As compared to the ball milling, the electrical conductivity of Ag4wt%SnO₂4wt%TiB₂ composites fabricated by filter paper template and starch template method is increased by 12.18 and 9.60 times, while the microhardness is increased by 17.10% and 33.94%, respectively. The filter paper template is more beneficial for the uniform dispersion of SnO₂ and TiB₂, which can alleviate concentrated arc erosion and reduce splash, thereby exhibiting better arc erosion resistance.