MeO掺杂AgSnO2电接触材料的结构与性能

Microstructure and Properties of MeO Doped Ag/SnO2 Electric Contact Materials

摘要:

采用机械合金化技术将不同用量的CuO或Fe₂O₃粉掺入银和SnO₂粉中制备Ag/SnO₂(x)-MeO(y)复合粉体,并辅以热压成型工艺制得Ag/SnO₂(x)-MeO(y)电接触材料。采用扫描电镜、X射线衍射仪、电阻测试仪、硬度计及拉伸试验机等测试仪器对材料的组织结构、物理和力学性能进行了表征。结果表明：随着掺杂剂用量的增加,Ag/SnO₂(x)-MeO(y)材料的密度逐渐降低,且CuO较Fe₂O₃更利于提高材料的导电性。两种掺杂剂均能显著改善Ag/SnO₂(x)-MeO(y)材料的塑性变形能力。Ag/SnO₂(11.2%)-CuO(0.8%) (也即CuO用量为0.8%)材料的电阻率达到最低值2.35 μΩ.cm,延伸率约为9.1%,比Ag/SnO₂材料的延伸率提高近93.6%,综合性能最优。

Abstract:

Ag/SnO₂(x)-MeO(y) composite powders were obtained by means of mechanical alloying different contents of CuO or Fe₂O₃ powders with Ag and SnO₂ powders, and Ag/SnO₂(x)-MeO(y) electrical contact materials were prepared by hot pressing process. The microstructure and physical and mechanical properties of the materials were characterized by scanning electron microscopy, X-ray diffractometry, resistance tester, hardness tester and tensile tester. The results show that the density of Ag/SnO₂(x)-MeO(y) materials decreases with the increase of dopant content, and CuO is more conducive to improving the conductivity of Ag/SnO₂(x)-MeO(y) material than Fe₂O₃. The two dopants can obviously improve the capacity of plastic deformation of Ag/SnO₂(x)-MeO(y) material. The Ag/SnO₂(11.2%)-CuO(0.8%) material (i.e. CuO content =0.8%) exhibits the best comprehensive properties with the resistivity about 2.35 μΩ?cm, elongation about 9.1% (higher than that of Ag/SnO₂ material by 93.6%).