Investigation of Partial Silver-Piating in Electronic Packaging

Abstract:

A photolithograph technology is used to fabricate patterned fine lead frame, and the factor of partial silver-plating is discussed. We find the pretreatment and electroplating technology is the key of plating layer quality: 1, current density can influence the roughness of silver plating surface, if it is 0.5 A/dm2, we can get the smooth silver plating; 2, electroplating time also plays an important role in controlling plating thickness, we can gain the even silver plating after 12 min-16 min plating.

Key words:electronic packaging,lead frame,partial silver-plating