- Ning Honglong,Geng Zhiting,Ma Jusheng,Huang Fuxiang,Qian Zhiyong,Chen Guohai
Ning Honglong,Geng Zhiting,Ma Jusheng,Huang Fuxiang,Qian Zhiyong,Chen Guohai
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TQ153.14
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Metallization is necessary for some packaging substrates. It is the key of metallization to improve the adhesion strength between copper plate and ceramic substrates. The adhesion between copper plate and ceramic substrates generally should be more than 15 MPa. Electroplated copper on alumina and aluminum nitride substrates has been studied. It is found that the roughening surface of the substrates can improve the adhesion. The technology of depositing copper plate and the testing methods of adhesion are also studied.
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[Ning Honglong, Geng Zhiting, Ma Jusheng, Huang Fuxiang, Qian Zhiyong, Chen Guohai. Research of Electroplating Cu on Pretreatment Ceramic Substrates[J]. Rare Metal Materials and Engineering,2004,33(3):321~323.]
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- Revised:August 01,2002