Liu Yangqiu1,Liang Tongxiang1,Fu Zhiqiang1,Ni Xiaojun1,Zhao Fuqun2
TN44 TG146
[Liu Yangqiu, Liang Tongxiang, Fu Zhiqiang, Ni Xiaojun, Zhao Fuqun. Effect of Heat Treatment on TiN Diffusion Barriers in Copper Thin Film Metallization on PI Substrates[J]. Rare Metal Materials and Engineering,2004,33(6):662~665.]
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