Effect of Ag and Ni Fine Particles on Mechanical Properties of SnPb Composite Solder
DOI:
Author:
Affiliation:
Clc Number:
TG457.1
Fund Project:
Article
|
Figures
|
Metrics
|
Reference
|
Related
|
Cited by
|
Materials
|
Comments
Abstract:
Reference
Related
Cited by
Get Citation
[Yan Yanfu, Liu Jianping, Shi Yaowu, Xia Zhidong. Effect of Ag and Ni Fine Particles on Mechanical Properties of SnPb Composite Solder[J]. Rare Metal Materials and Engineering,2005,34(4):622~626.] DOI:[doi]