Analysis of the Sub-Directed Walking of Cathode Spots on the Surface of Nanocrystalline Copper
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TG146.4 TG174.21
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Abstract:
By using a Scanning Electron Microscope (SEM), the tracks of cathode spots on the surface of nanocrystalline Cu cathode produced after the first discharge with peak current of 10 A was investigated. It is found that the movement of cathode spots is sub-directed rather than random. The reason is explained in comparison with conventional Cu. It is suggested that sub-directed walking of cathode spots on the surface of nanocrystalline Cu is beneficial to the diffusion of cathode spots which is responsible for cathode erosion.
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[Su Yafeng, Yang Zhimao, Ding Bingjun. Analysis of the Sub-Directed Walking of Cathode Spots on the Surface of Nanocrystalline Copper[J]. Rare Metal Materials and Engineering,2007,36(1):68~70.] DOI:[doi]