Abstract:In this paper,the atoms diffusion and growth behavior of intermetallic compounds(IMCs) on the Sn-Ag-Cu/Ni and Sn-Ag-Cu/Cu interfaces under the thermal-shearing cycling condition were investigated.The results showed that two kinds of IMCs,(CuxNi1-x)6Sn5 and(NixCu1-x)Sn3,formed on the Sn-Ag-Cu/Ni interface,but only Cu6Sn5 IMC layer formed on the Sn-Ag-Cu solder and Cu interface under the thermal-shearing condition of 720 cycles.The morphology of(CuxNi1-x)6Sn5 and Cu6Sn5 IMCs varied from scallop-type to planar-type with increasing the thermal-shearing cycling periods,while(NixCu1-x)Sn3 IMC formed surrounding(CuxNi1-x)6Sn5 IMC after 200 cycles.The IMC thickness increased with the increasing of thermal-shearing cycling periods by a role of parabolic growth kinetics,it implied that the IMC growth was controlled by Cu atom diffusion.