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Effects of TiC on Microstructures and Properties of CuW Electrical Contact Materials
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TG146.23 TG146.11

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    Abstract:

    A series of Cu-W alloys added with TiC particles were prepared by means of powder metallurgy-infiltration process. The effects of TiC addition on the microstructure and properties were investigated for the Cu-W alloys, respectively, including the static property and the vacuum breakdown property. The results showed that the hardness of W-Cu alloys increased with increasing percentage of TiC, while the electric conductivity changed slightly for TiC addition in the range of 0wt %-1.2wt%, but dramatical decreases were observed for TiC addition from 1.2wt% to 2wt%. The dielectric strength was improved and the chopping current of was decreased by TiC phase addition. The metallographic analysis of Cu-W alloys after vacuum breakdown showed that the splash of liquid copper was decreased because the TiC phase nailed on the skeletons of tungsten. The vacuum breakdown took place in interphase boundaries of copper and TiC with smaller cathode craters.

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[Yang Xiaohong, Fan Zhikang, Liang Shuhua, Xiao Peng. Effects of TiC on Microstructures and Properties of CuW Electrical Contact Materials[J]. Rare Metal Materials and Engineering,2007,36(5):817~821.]
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  • Received:
  • Revised:May 10,2006
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