Effects of Substrate Miscut Angle on Microstructure and Superconductivity of YBCO Films

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Effects of Substrate Miscut Angle on Microstructure and Superconductivity of YBCO Films
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                        Wang Tiansheng, Tian Yongjun, Peng Wei, Qi Hanhong,Li LinWang Tiansheng, Tian Yongjun, Peng Wei, Qi Hanhong,Li Lin

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Key words:YBCO film; microstructrue; miscut substrate; superconductivity

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[9]Liu Chunfang,Wu Xuan,Wu Huan,Feng Yong,Zhang Pengxiang,Wu Xiaozu,Zhou Lian.X-ray Study of Cube Textured Ni Substrate for YBCO Thick Films[J].Rare Metal Materials and Engineering,1998,27(5):259-262.

[10]王敬,刘安生,石东奇,王晓华,邵贝羚,袁冠森.Relation of Deposition Condition with Microstructure of YBCO Film and YSZ Buffer Layer on Metallic Substrate[J].Rare Metals,1998(1).

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[12]王敬,刘安生,石东奇,王小平,王晓华,邵贝羚,袁冠森.Microstructure of YBCO Superconducting Film on Metal Substrate with YSZ Buffer Layer[J].Journal of Rare Earths,1998(1).

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[15]Wang Ruikun, Sun Lihong, Liu Hongfei,Wang Xiaoping, Yang Bingchuan.Study on Morphology of Surface of Large Area YBCO Thin Films on Zr(Y)O_2 Substrate[J].Journal of Rare Earths,1996(3).

[16]YE Shuai,SUO Hong-Li,WU Zi-Ping,LIU Min,XU Yan,MA Lin.Research on Improving In-field Property of YBCO Films[J].Journal of Inorganic Materials,2011,26(7):765-768.

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[18]WANG Jue,MALOUFI Nabila,FAN Zhanguo,XUE Xiangxin,ESLING Claude.Microstructure and texture analysis of YBCO thick film with peritectic growth on unoriented silver substrate[J].Journal of Rare Earths,2009,27(3):474-479.

[19]Wang Ruikun,Wang Xiaoping,Yang Bingchuan,Liu Ansheng and Yuan Guansen.Microstructures of YBCO Thin Film Deposited on LaAlO_3 Substrate[J].Rare Metals,1996(4).

[20]Youngha Kim,Kyong H. Lee,Tae-Hyun Sung,Sang-Chul Han,Young-Hee Han,Nyeon-Ho Jeong,Kwangsoo No.Superconductivity of YBCO Thick Films Prepared by Spark Plasma Sintering[J].Journal of Electronic Materials,2007,36(10):1252-1257.

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[Wang Tiansheng, Tian Yongjun, Peng Wei, Qi Hanhong, Li Lin. Effects of Substrate Miscut Angle on Microstructure and Superconductivity of YBCO Films[J]. Rare Metal Materials and Engineering,2007,36(5):862~864.]
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