Relation between the Surface Condition and Microstructure of Solder Balls
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[Yu Yang, Shi Yaowu, Xia Zhidong, Lei Yongping, Guo Fu, Li Xiaoyan, Chen Shujun. Relation between the Surface Condition and Microstructure of Solder Balls[J]. Rare Metal Materials and Engineering,2008,37(6):1092~1094.] DOI：[doi]