Zeng Ming
Sichuan University, Chengdu 610064, ChinaChen Zhengzhou
Xihua University, Chengdu 610039, ChinaShen Baoluo
Sichuan University, Chengdu 610064, ChinaXu Daofen
Xihua University, Chengdu 610039, ChinaLiao Chunli
Xihua University, Chengdu 610039, China
[Zeng Ming, Chen Zhengzhou, Shen Baoluo, Xu Daofen, Liao Chunli. Research on Indentation Creep Property of Sn-3.5Ag-2Bi-0.7Cu Lead-Free Solder[J]. Rare Metal Materials and Engineering,2009,38(8):1353~1357.]
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