Lu Yudong
National Key Laboratory for Reliability Physics and Its Application Technology of Electrical Component, the 5th Electronics Research Institute of the Ministry of Information Industry, Guangzhou 510610, ChinaHe Xiaoqi
National Key Laboratory for Reliability Physics and Its Application Technology of Electrical Component, the 5th Electronics Research Institute of the Ministry of Information Industry, Guangzhou 510610, ChinaEn Yunfei
National Key Laboratory for Reliability Physics and Its Application Technology of Electrical Component, the 5th Electronics Research Institute of the Ministry of Information Industry, Guangzhou 510610, ChinaWang Xin
South China University of Technology, Guangzhou 510640, chinaZhuang Zhiqiang
South China University of Technology, Guangzhou 510640, china
[Lu Yudong, He Xiaoqi, En Yunfei, Wang Xin, Zhuang Zhiqiang. Polarity of Electromigration at the Interface between SnPb Solder Joints and Ni/Au Finishes[J]. Rare Metal Materials and Engineering,2010,39(2):254~257.]
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