Effect of Cu Content on Interface Microstructures of Oxygen-Permeable Membrane Brazed with Ag-Cu Brazing Filler

Abstract:

Ag-Cu brazing filler were adopted to seal oxygen-permeable membrane ceramics and stainless steel support, and the effect of Cu content on interface microstructure of oxygen-permeable membrane brazed with Ag-Cu brazing filler was investigated. The microstructure of the interface was observed by SEM and the constituent phases were analyzed by EDS. The results show that no elemental interdiffusion occurs in the interface of pure Ag and oxygen-permeable membrane; the addition of 1 at%Cu doesn’t improve the bonding of the interface obviously; when the Cu content reaches 3.3 at%, a reaction layer of about 200 μm in thickness forms on the membrane side due to the diffusion of Cu and Ag, which indicates the good wetting ability and interface bonding between Ag-3.3Cu brazing filler and oxygen-permeable membrane.