Interface Deformation and Rolling Thickness-Ratio of Cu/Mo/Cu Composite Plates

Abstract:

Effects of rolling process on bonding interface and the element thickness-ratio of Cu/Mo/Cu cladding plates prepared by hot rolling and warm rolling were studied. The results show that the Cu/Mo interface is closely bonded after rolling deformation and the bonding mechanism of Cu/Mo is dentate meshing. The grain of Cu layer near the surface and the interface is smaller than that in the center. With the increase of the deformation, the equiaxed grains of Cu layer are stretched along the rolling direction. The bonded effect of the interface is significantly improved and becomes straighter from the dentition. The deformation of Cu layer is larger than that of Mo layer. The thickness-ratio was analyzed. With the increase of the total reduction, the difference of the element deformation decreases and the element deformation gradually tends to conform. The thickness-ratio of Cu/Mo/Cu composites relation is proposed and it offers a method for base material choice

Key words:Cu/Mo/Cu; rolling; thickness-ratio