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Influence of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives
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Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology,Department of Chemistry and Biology, University of Electronic Science and Technology of China Zhongshan Institute,Department of Materials Science and Engineering, Tsinghua University,State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology

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TQ 630.7

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    Abstract:

    In this paper, a typical isotropic conductive adhesives (ICAs) composed of an epoxy-based binder containing micro-sized silver flakes was prepared and the effects of the different curing procedures on the electrical properties of the ICAs were investigated. The results showed that there is greater influence of the curing temperature on 55 wt % silver loading, the volume resistivity of ICAs decreased to 4.5 ×10-3 from 5.2×10-2 cured at 250 0C and 180 0C, respectively. However, there is almost no effect on the high silver loading. The in situ monitoring the variations in electrical resistance of the ICAs with 65 wt % silver loading was studied during the curing process, and it was found that the resistance reached to 1.99 ×106 Ω at 180 0C after cured for 27 min, and reached to 1.39 ×10-3 Ω for 40 min, and 18.8 Ω for 60 min and the cooling process has almost no effect on the electrical resistance of the ICAs. The reasons for the dependence of the bulk resistivity on temperatures were also discussed in terms of the dispersing of the silver flakes in ICAs by SEM.

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[WANG YUE HUI, Li zhiling, Xiehui, Yuzhan Zhao, LIJingze. Influence of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives[J]. Rare Metal Materials and Engineering,2016,45(10):2524~2528.]
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History
  • Received:June 26,2014
  • Revised:July 30,2014
  • Adopted:November 20,2014
  • Online: November 10,2016
  • Published: