Diffusion Bonding of TiC cermet to Stainless Steel using Impulse Pressuring with Ti-Nb Interlayer

Abstract:

_{:Impulse pressuring diffusion bonding (IPDB) of TiC cermet to stainless steel 06Cr19Ni10 using Ti-Nb interlayer was carried out in an attempt to reduce the bonding time and alleviate the detrimental effect of interfacial reaction products on bonding strength. Successful bonding was achieved at 890℃ under a pulsed pressure of 2~10MPa within a duration of only 4~12min, which was notably shortened in comparison with conventional diffusion bonding. Microstructure characterization revealed the existence of the σ phase with a limit solubility of Nb, (β-Ti, Nb) phase, and solid solution of Ni in α β-Ti in the reaction zone. Maximum shear strength of 110MPa was obtained when the joint was bonded for 10min, indicating a robust metallurgical bonding was achieved. Upon shear loading, the joints fractured along the remnant Ti/ α β-Ti interfaceand extended to the interior of TiC cermet in a brittle cleavage manner. This technique provides a highly promising bonding method of TiC cermet and steel.}