Wang Fangyu
Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,BeijingWang Wenchao
Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,BeijingShi Ming
Fujian Institute of Research on the Structure of Matter,Chinese Academy of Sciences,Fuzhou,FujianLin Yue
Fujian Institute of Research on the Structure of Matter,Chinese Academy of Sciences,Fuzhou,FujianGuo Wang
Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,BeijingYuan Xuanyi
Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,BeijingCao Yongge
Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,BeijingBeijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Fujian Institute of Research on the Structure of Matter,Chinese Academy of Sciences,Fuzhou,Fujian,Fujian Institute of Research on the Structure of Matter,Chinese Academy of Sciences,Fuzhou,Fujian,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing
TB333; TF124
[Wang Fangyu, Wang Wenchao, Shi Ming, Lin Yue, Guo Wang, Yuan Xuanyi, Cao Yongge. Fabrication of Diamond/copper Composites by Hot Isostatic Pressing[J]. Rare Metal Materials and Engineering,2017,46(3):853~856.]
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