Fabrication of Diamond/copper Composites by Hot Isostatic Pressing

Abstract:

Diamond/copper composites were successfully fabricated by hot isostatic pressing(HIP) at a temperature of 900 ℃ and a pressure of 110 MPa for 1 h, and their microstructure and thermal properties were also studied. The results show that diamond particles are dispersed homogeneously in the copper matrix without evident graphitization. With increasing volume fraction of diamond, the relative density, thermal conductivity and coefficient of thermal expansion of the composites decrease. The maximum relative density and thermal conductivity of these samples are up to 98.5% and 305 W/mK, respectively. The diamond/copper composites prepared by HIP can achieve equal or even higher thermal conductivity than those fabricated by hot pressing(HP) and spark plasma sintering(SPS). Obviously, HIP shows great potential in preparing diamond/copper composites.