+Advanced Search
Impulse Pressuring Diffusion Bonding of Titanium to Stainless Steel Using a Copper Interlayer
DOI:
Author:
Affiliation:

Clc Number:

Fund Project:

SB RAS Project (III.23.2.1); Fundamental Research Project of Byelorussian AS and Fundamental Research Program OEMMPU RAS “Multiscale Investigation of Properties and Behavior of Advanced Materials”

  • Article
  • |
  • Figures
  • |
  • Metrics
  • |
  • Reference
  • |
  • Related
  • |
  • Cited by
  • |
  • Materials
  • |
  • Comments
    Abstract:

    Impulse pressuring diffusion bonding of commercially pure titanium to 1Cr18Ni9 stainless steel was carried out using a copper interlayer in an attempt to reduce the bonding time and alleviate the detrimental effect of interfacial reaction products on bonding strength. Successful bonding has been achieved at 850 °C under a pulsed pressure of 8~20 MPa within a duration of only 120~180 s, which is notably shortened in comparison with conventional diffusion bonding. Microstructure characterization revealed that a sequence of Ti-Cu intermetallic compounds were formed at the Ti/Cu interface and the Cu/stainless steel interface was characterized by the presence of solid solution of Cu in γ Fe without any interfacial reaction products. Maximum bonding strength of 346 MPa was obtained when the joint was bonded for 120 s. Upon tensile loading, the joints fractured along the Ti/Cu interfacial reaction layer in a brittle cleavage manner, indicating that the impulse pressuring diffusion bonding can alleviate the harmful influence of interfacial intermetallic compounds on joint performances to a certain extent, but it is infeasible in completely eliminating the negative effect of the brittle intermetallic compounds.

    Reference
    Related
    Cited by
Get Citation

[Deng Yongqiang, Sheng Guangmin, Yin Lijing. Impulse Pressuring Diffusion Bonding of Titanium to Stainless Steel Using a Copper Interlayer[J]. Rare Metal Materials and Engineering,2015,44(5):1041~1045.]
DOI:[doi]

Copy
Article Metrics
  • Abstract:
  • PDF:
  • HTML:
  • Cited by:
History
  • Received:May 14,2014
  • Revised:
  • Adopted:
  • Online: June 08,2015
  • Published: