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Study on thermal reliability of Gold Filmon the surface of Tungsten Helix
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Beijing University of Technology,Beijing University of Technology,Beijing University of Technology,Beijing University of Technology,Beijing University of Technology

Clc Number:

TB34

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    Abstract:

    Tungsten helix is a component of transfer wave tube (TWT), its high frequency loss and heat dissipation become serious with power level and working frequency of TWT increasing. To solve the problems, gold thin films were deposited on the surface of helix in our previous. How is the thermal reliability of gold thin films when helix operates at higher temperature? In this paper, the binding force between gold film and substrate was tested by using nanoscratch. The film binding forces of samples pre-plated copper respectively for 5s,10s,15s,20s and then gold-plated for 1.5h before and after heat treatment were analyzed.The results indicate that the films adhesion of samples after heat treatment show no obvious decrease compared with those of as-deposited samples. Especially, the binding force of the sample pre-plated copper for 10s after heat increases . The thermal reliability of gold films is good.

    Reference
    [1]Han Yong; Liu Yanwen, Ding Yaogen. IEEE Transactions on Electron Devices[J], 2007, 54(6): 1562
    [2]Ghosh Tushar K, Challis Anthony J, Jacob Alan et al. IEEE Transactions on Electrin Device [J] , 2008, 55(2): 668
    [3]Werner Gerum, Manfred Bruck, Gerd Fisher et al. IEEE Transactions on Electrin Device[J], 2005, 52(5) : 669
    [4]Li Guochao(李国超), Xiao Liu(肖 刘), Hao Baoliang(郝保良) et al. Chinese Journal of Vacuum Science and Technology(真空科学与技术学报)[J], 2010, 30( 4) : 374
    [5]Menninger W L, Benton R T, Zhai X et al. IEEE International Vacuum Electronics Conference[C]. Kitakyushu:JCS Convention Design Inc,2007
    [6]Qiu J X, Abe D K, Antonsen T M et al. Transactions on Microwave Theory and Techniques [J], 2003, 51(8) : 1911
    [7]Sauseng O, Manoly A E, Hall A et al. IEDM[J], 1978, 24: 534
    [8]Jain P K, Basu B N . IEEE Trans on ED[J], 1988, 35( 4) :549
    [9]Zhao Xingqun(赵兴群),Zhang Guoxing(张国兴), Sun Xiaohan (孙小菡).Electronic journal(电子学报)[J],2004, 32( 6) : 1029
    [10]Shi Guangtian(石广田),Shi Zongli(石宗丽),Yu Huanran(俞焕然) et al.Journal of Lanzhou University(兰州大学学报)[J],2002,38(6):48
    [11]Peng Zhijian(彭志坚),Miao Hezhuo(苗赫濯),Qi Longhao(齐龙浩).Journal of Lanzhou University(兰州大学学报) [J] , 2004,33(5):507
    [12]Godara A, Raabe D, Green S. Acta Biomaterialia[J], 2007,3(2):209
    [13]Youn S W, Kang C G . Wear [J], 2006, 261(3-4):328
    [14]Ouyang J H, Sasaki S, Murakami J et al. Wear[J],2009,266(1-2):96
    [15]Singh S, Pandey M, Kishore R et al. Plasma Processes Polym[J],2008,5(9):853
    [16]Fan Ailing(范爱玲),Chang Suijie(常随杰),Xue Yingkun(薛迎坤)et al. Rare Metal Materials and Engineering(稀有金属材料与工程) [J],2015,44(3):612
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[Fan Ailing, Li Weitian, Xue Yingkun, Chang Suijie, Ma Jie. Study on thermal reliability of Gold Filmon the surface of Tungsten Helix[J]. Rare Metal Materials and Engineering,2016,45(7):1788~1792.]
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History
  • Received:September 29,2015
  • Revised:December 28,2015
  • Adopted:January 14,2016
  • Online: October 09,2016

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