A coupled DIC/EBSD analysis of the microstructure evolution and strain localization during bending in Al-Li alloy

Abstract:

The damage mechanism of commercial 2060 (T8) aluminum alloy during bending was studied in this work. The microstructure evolution and strain localization was collected by Electron Backscattered Diffraction (EBSD) and Digital Image Correlation (DIC) methods, respectively. The new method based on the dispersion distribution of copper powders was developed, which can be used to characterize the strain distribution and microstructure evolution of the same region simultaneously. The experimental results showed that macro shear band formed during bending and the crack grow along the macro shear band, the reason for this phenomenon can be attributed to the larger volume fraction of Small Angle Grain Boundary (SAGBs) formed in the region of macro shear band, since less energy was needed if the crack propagated along the direction of macro shear bands.