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Properties of Cu-P Brazing Filler Metal After Hot-Dip Tinning
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Affiliation:

State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd, Zhengzhou 450001, China

Clc Number:

TG454

Fund Project:

Science and Technology Major Project of Zhengzhou City (2019CXZX0065); Leading Talents of Science and Technology in Central Plains (ZYQR20180030)

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    Abstract:

    The CuPSn brazing filler metal was prepared on the basis of Cu93P brazing filler metal by hot-dip tinning. The interface morphology of tin coating was observed by scanning electron microscope. The tensile strength, microhardness, melting temperature and wettability of the brazing filler metal were investigated by universal mechanical testing machine, micro-hardness tester, differential thermal analyzer, resistance furnace and stereomicroscope. The results indicate that the liquid tin reacts with the brazing filler metal to form Cu6Sn5 intermetallic compound during hot-dip tinning, which means that the brazing filler metal and tin coating form good metallurgical bonding. The tensile strength and microhardness of brazing filler metal decrease with the increase of hot-dipping temperature and time. The decrease of tensile strength is due to the formation of Cu6Sn5 brittle compound and pores at the interface, and the decrease of microhardness is due to the stress-relieving annealing effect of hot-dip. Hot-dip tinning can reduce the melting temperature and improve the wettability of the brazing filler metal. The wetting area of brazing filler metal increases by about 43.15% compared with that of the matrix when 5.20wt% tin is hot dipped in it, and the Cu88.16P6.64Sn5.20 brazing filler metal possesses a good wettability.

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[Dong Bowen, Zhong Sujuan, Pei Yinyin, Shen Yuanxun, Long Weimin. Properties of Cu-P Brazing Filler Metal After Hot-Dip Tinning[J]. Rare Metal Materials and Engineering,2021,50(10):3527~3531.]
DOI:10.12442/j. issn.1002-185X.20200629

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History
  • Received:August 22,2020
  • Revised:September 24,2020
  • Adopted:October 15,2020
  • Online: October 28,2021
  • Published: October 25,2021