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Preparation of ytterbium-copper and ytterbium-copper-aluminum amorphous films by magnetron co-sputtering
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Baotou Rare Earth Research Institute,State Key Laboratory of Baiyunobo Rare Earth Resource Researches and Comprehensive Utilization

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    Abstract:

    Amorphous alloy is a new type of multicomponent alloy material which is different from common metal materials, in which rare earth-based amorphous alloy is an important member of metallic glass family. However, due to the high activity of rare earth elements and stringent preparation requirements of metallic glass, the related research progress is slow, and the research of new system amorphous alloy still adopts a large number of original methods of trial and error. In this paper, based on the concept of high-throughput material genetic engineering, metal thin films with continuous change of chemical composition were prepared by tilting target and adjusting single metal target power, so as to quickly screen the composition range of YbCu amorphous alloy, and successfully prepared YbCu amorphous alloy film for the first time. At the same time, the influence of aluminum on the formation of YbCu amorphous alloy was studied and prepared YbCuAl amorphous films were prepared. When the Yb is less than 44.5-46.5 wt%, the films are all amorphous. The results show that the surface of YbCu amorphous alloy is smooth without defects, and the absolute height difference is only 31.6 nm. The film is hydrophobic with a maximum hydrophobic angle of 119 °. In addition, the maximum square resistance of YbCu and YbCuAl amorphous films is 551 mΩ □-1 and 1738 mΩ □-1, respectively. The alloying element Al has a significant effect on the properties of YbCu amorphous films. Therefore, the composition screening and successful preparation of YbCu(Al) amorphous films accelerate the development of rare earth based amorphous materials.

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[CUI Hong-bing. Preparation of ytterbium-copper and ytterbium-copper-aluminum amorphous films by magnetron co-sputtering[J]. Rare Metal Materials and Engineering,2022,51(3):1040~1046.]
DOI:10.12442/j. issn.1002-185X.20210138

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History
  • Received:February 19,2021
  • Revised:April 29,2021
  • Adopted:May 12,2021
  • Online: April 06,2022
  • Published: March 30,2022