Abstract:The microstructure evolution and the static recrystallization kinetics of metal beryllium during annealing at 680–880 ℃ were investigated. The isothermal compression test was conducted on an Instron 5582 testing machine and the recrystallized fraction of metal beryllium under varying strain temperatures (250–450 ℃), strain rates (10–1–10–4 s–1), and true strains (0.16–0.92) was obtained. The results show that decreasing the strain temperature and increasing the strain rate can promote the progress of beryllium recrystallization. As the strain is increased, the beryllium recrystallized grains are refined, and the recrystallization rate is accelerated. However, the effect of increasing the strain on improving the recrystallization rate of beryllium is diminished when the true strain increases to more than 0.60. Increasing the annealing temperature, the recrystallization rate of beryllium is significantly accelerated. In particular, when the annealing temperature is elevated from 750 ℃ to 780 ℃, the recrystallization rate of beryllium enhances dramatically. At 880 ℃, the time for beryllium to complete recrystallization is reduced to approximately 5 min. The static recrystallization activation energy of beryllium is 396.56 kJ·mol–1 at 680–750 ℃, while it is only 72.93 kJ·mol–1 at 780–880 ℃. A static recrystallization kinetic model of beryllium with a modified Avrami component n is constructed. The calculated values of the model are in good agreement with the experimental values, which indicates that the model can accurately predict the static recrystallized fraction of beryllium deformed at 250–450 ℃, meeting the requirements of engineering applications.