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Thermal Stability of SiCf/Ti-60 Composites
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Institute of Metal Research,Chinese Academy of Sciences,Institute of Metal Research,Chinese Academy of Sciences,Institute of Metal Research,Chinese Academy of Sciences,Institute of Metal Research,Chinese Academy of Sciences,Institute of Metal Research,Chinese Academy of Sciences,Institute of Metal Research,Chinese Academy of Sciences

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    Abstract:

    Thermal stability of SiCf/Ti-60 composites under thermal exposure at different temperature was studied. Interfacial reaction layer and element diffusion of SiCf/Ti-60 composites after HIP and thermal exposure were also investigated. The results showed that the mainly product of reaction layer was TiC. The interdiffusion of C or Si in SiC fiber and Ti or other elements in matrix occurred. TiC was formed at the interface and in the matrix due to the high diffusion rate of C. TiC mainly existed on the grain boundaries of matrix. The growth behavior of SiCf/Ti-60 composites reaction layer was influenced by diffusion and followed an Arrhenius law. The preexponential factor and the activation energy of SiCf/Ti-60 composites were 2.27×10-4 m/s1/2 and 118 kJ/mol respectively.

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[Kong Xu, Wang Yumin, Zhang Xu, Yang Qing, Yang Lina, Yang Rui. Thermal Stability of SiCf/Ti-60 Composites[J]. Rare Metal Materials and Engineering,2017,46(S1):71~75.]
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History
  • Received:May 12,2016
  • Revised:May 12,2016
  • Adopted:August 08,2017
  • Online: December 13,2017
  • Published: