Effect of Bonding Temperature on Microstructure and Strength of W/CuCrZr Alloy Joints Diffusion Bonded with a Ti Interlayer

Abstract:

Ti interlayer was selected for the bonding of tungsten to CuCrZr alloy. The effects of bonding temperature on the microstructures and shear strength of the joints were investigated. The results show that the brittle intermetallic compound of diffusion layers significantly effect the strength of the joint. The molten is formed due to eutectic reaction between Ti and Cu at 1030 °C, most part of the molten is extruded out from the bonding zone, where a little amount of intermetallic compound is remained in the interfacial layer, resulting in increasing of joint strength. The shearing strength of the joint is even higher than that of W substrate.