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Investigation of the microstructure of pressure-assisted Ag sintering layer by deep-etching method
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Affiliation:

1.School of Material Science and Engineering,Harbin University of Science and Technology;2.Boschman Technologies B.V.;3.EEMCS Faculty, Delft University of Technology

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Fund Project:

National Natural Science Foundation of China (No. 51604090), Natural Science Foundation of Heilongjiang Province (No. E2017050), and University Nursing Program for Young Scholars with Creative Talents in Heilongjiang Province (UNPYSCT-2015042)

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    Abstract:

    In this study, nano silver (Ag) film was used as the bonding material. High quality bonding layers with low porosity (1.2% to 1.4%) were obtained when the sintering pressure ranged from 5 to 10 MPa at 250 ℃. As the sintering pressure increased from 5 to 10 MPa, the shear strength of the pressure-assisted sintering specimens was improved. The microstructure of the sintered layers was investigated in comparison with the bulk Ag by deep-etching method. The results revealed that the deep-etched morphology of the sintered layer was quite different from that of the bulk Ag. Micron-scale polyhedral Ag grains were observed in the deep-etched morphology of the sintered layers. The grain size and the area of the interfaces between these polyhedral Ag grains changed as the sintering pressure increased from 5 to 10 MPa. This is considered as the dominate factor in the bonding properties of the sintered layers.

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[Liu Yang, Zhang Hao, Li Zhao, Wang Lingen, Sun Fenglian, Zhang Guoqi. Investigation of the microstructure of pressure-assisted Ag sintering layer by deep-etching method[J]. Rare Metal Materials and Engineering,2020,49(1):42~47.]
DOI:10.12442/j. issn.1002-185X.20180788

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History
  • Received:July 22,2018
  • Revised:December 19,2019
  • Adopted:September 13,2018
  • Online: February 16,2020
  • Published: