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IMC growth at Ni/liquid Sn interface under ultrasonic treatment
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State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal,Lanzhou University of Technology

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TG454

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    Abstract:

    The paper investigated the formation and evolution of intermetallic compound at the interface of Ni/Sn with and without USV. Without ultrasonic treatment, the IMC layer are plain and compact at the interface of Ni/Ni3Sn4. Towards the solder side, Sn tends to wet and penetrate the grain boundaries to form the scallop-type Ni3Sn4. Moreover, intermetallic grains grow with a 1/2 power dependence on time, the growth was controlled by the bulk diffusion. With ultrasonic treatment, acoustic cavitation causes the interfacial Ni3Sn4to dissolve and forms many grooves, even forms is reopened and ultrasonic streaming promotes this dissolution. With prolong of ultrasonic time, elongated Ni3Sn4grains which was "neck" connection are broken up by the ultrasonic cavitation and fall into the liquid solder. Interfacial IMC was gradually reduction. The Ni3Sn4 grains falling into the liquid are further dissolved and broken by ultrasonic cavitation. Finally many fine Ni3Sn4 grains are evenly distributed in the joint.

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[Liu yun, Yu weiyuan, Wang yanhong, Sun xuemin. IMC growth at Ni/liquid Sn interface under ultrasonic treatment[J]. Rare Metal Materials and Engineering,2020,49(4):1402~1408.]
DOI:10.12442/j. issn.1002-185X.20190035

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History
  • Received:January 09,2019
  • Revised:January 31,2019
  • Adopted:March 15,2019
  • Online: May 07,2020
  • Published: