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Study on rigid restraint thermal self-compressing bonding of Ti6Al4V alloy by local induction heating
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the National Natural Science Foundation of China (No.51705491).

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    Abstract:

    Rigid restraint thermal self-compressing bonding (TSCB) by localized induction heating, a new diffusion bonding technology was proposed in this paper. Experiments were conducted on Ti6Al4V plates to prove the feasibility of rigid restraint thermal self-compressing bonding by local induction heating. Moreover, finite element analysis was employed to numerically investigate the thermal elastic-plastic stress-strain cycle during thermal self-compressing bonding by localized induction heating. Results show that solid-state joint with homogeneous microstructure and excellent mechanical properties was attained. By localized induction heating, an internal elasto-plastic stress-strain field is developed which makes the bond interface subjected to thermal compressive action. This thermal self-compressing action combined with the high temperature on the bond interface promotes the atom diffusion across the bond interface to produce solid-state joints.

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[Pan Rui, Deng Yunhua, Zhang Hua. Study on rigid restraint thermal self-compressing bonding of Ti6Al4V alloy by local induction heating[J]. Rare Metal Materials and Engineering,2021,50(2):373~379.]
DOI:10.12442/j. issn.1002-185X.20200007

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History
  • Received:January 04,2020
  • Revised:March 31,2020
  • Adopted:April 02,2020
  • Online: March 09,2021
  • Published: