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Effect of thermal cycling on interface and properties of Sn58Bi(nano Ti)/Cu solder joints
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Affiliation:

School of Mechanical Electrical Engineering,Jiangsu Normal University

Clc Number:

TG 425

Fund Project:

the Key project of State Key Laboratory of Advanced Welding and Joining,Natural Science Foundation of China,Six talent peaks project in Jiangsu Province

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    Abstract:

    In order to improve the performance of Sn-58Bi lead-free solder, the Sn-58Bi-0.1Ti nanometer reinforced composite solder was prepared by incorporating 0.1% Ti nanoparticles into the Sn-58Bi solder. In this paper, the effect of adding Ti nanoparticles on the growth behavior of intermetallic compounds (IMC) in Sn-58Bi/Cu solder joints during thermal cycling was studied. The results showed that a scallop-like Cu6Sn5 IMC layer was formed at Sn-58Bi /Cu and Sn-58Bi-0.1Ti/Cu interface after reflow soldering. After 300 thermal cycles, a layer of Cu3Sn IMC was formed at the Cu6Sn5/Cu interface. The thickness of IMC layer of Sn-58Bi/Cu solder joint and Sn-58Bi-0.1Ti/Cu solder joint is proportional to the square of thermal cycling time. However, the IMC thickness of Sn-58Bi-0.1Ti/Cu solder joint is significantly lower than that of Sn-58B/Cu solder joint, which indicated that the addition of Ti nanoparticles can effectively inhibit the excessive growth of interfacial IMC during the thermal cycle process. In addition, the IMC layer diffusion coefficients of these two solder joints were calculated, and it was found that the diffusion coefficients of IMC layer in Sn-58Bi-0.1Ti/Cu solder joint (overall IMC, Cu6Sn5 and Cu3Sn IMC) were smaller than that of Sn-58Bi/Cu solder joint, which explained the inhibitory effect of Ti nanoparticles on the interface IMC layer to some extent.

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[Jiang Nan, Zhang Liang, Sun Lei, Wang Fengjiang, Long Weimin, Zhong Sujuan. Effect of thermal cycling on interface and properties of Sn58Bi(nano Ti)/Cu solder joints[J]. Rare Metal Materials and Engineering,2021,50(1):327~332.]
DOI:10.12442/j. issn.1002-185X.20200075

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History
  • Received:February 10,2020
  • Revised:April 18,2020
  • Adopted:April 26,2020
  • Online: February 05,2021
  • Published: