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Microstructure and magnetron sputtering properties of W/Re alloy targets fabricated by powder metallurgy
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1.Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Material,Hunan University of Science and Technology;2.Hunan Provincial Key Defense Laboratory of High Temperature Wear-Resisting Materials and Preparation Technology,Hunan University of Science and Technology;3.State Key Laboratory of Powder Metallurgy,Central South University

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TG146.4

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    Abstract:

    In order to development high quality W/Re alloy targets, pure W and W/Re alloy (with 1wt.%, 5wt.% and 10wt.% content of Re) was fabricated by mechanical mixing, press forming and vacuum sintering. Properties such as relative density, grain size and direction, magnetron sputtering of W/Re alloy were investigated. Relative density of W/Re alloy increased with content of Re addition. And relative density of W/10wt.%Re was high up to 96.6%. EPMA results showed that the purity of W/10wt.%Re alloy target was very high. And grain size of W/10wt.%Re alloy was mainly distributed between 10 μm and 40 μm. The grain size of W/Re alloy was randomly distributed without preferred orientation as shown in EBSD results. And content of small angle grain boundary (< 10 °) of W/10wt.%Re alloy was more than 85%. The grain size of W/Re alloy thin film was gradually refined as deposition pressure of magnetron sputtering increasing. Meanwhile, both surface flatness and thickness of thin film were gradually increased. XRD spectra of thin films showed that (110), (200) and (211) diffraction peaks appeared near 40.5 °, 58.6 ° and 73.5 °, respectively. As the deposition pressure increasing, the intensity of (110) diffraction peaks decreased gradually, while those of (200) diffraction peaks increased gradually.

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[WANG Yueming, TANG Qiuhao, XIONG Xiang. Microstructure and magnetron sputtering properties of W/Re alloy targets fabricated by powder metallurgy[J]. Rare Metal Materials and Engineering,2021,50(3):1044~1054.]
DOI:10.12442/j. issn.1002-185X.20200349

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History
  • Received:May 21,2020
  • Revised:July 27,2020
  • Adopted:August 04,2020
  • Online: April 02,2021
  • Published: