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Study on the properties of WC@W-Cu composite prepared by electroplating
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School of Materials Science and Engineering,Nanchang University

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The National Natural Science Foundation of China (General Program, Key Program, Major Research Plan)

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    Abstract:

    W-Cu composite are widely used as materials for electronic packaging, electrodes, electrical contacts, and shells of artillery shells because of its low expansion coefficient, high strength, high electrical and thermal conductivity. The traditional preparation methods of W-Cu composite are difficult to take into account the densification and the uniformity of the microstructure, resulting in insufficient electrical and thermal conductivity of the material, and it is difficult to meet the requirements of the modern electronics industry. Using W powder and WC@W powder obtained by carbonization of the surface of W powder as raw materials, W-Cu and WC@W-Cu composites were successfully prepared by composite electroplating technology. The results show that the surface of W-Cu composite is rough and there are holes in the microstructure, while the WC@W-Cu composite has refined grains, and the microstructure is uniform and dense. The W content of WC@W-Cu composite is 43.6wt.%, the hardness is 205HV, the relative density is 99.3%, and the electrical conductivity can reach 54.6MS/m. The WC@W-Cu composite not only increases the W content and significantly improves the hardness, but also is better than the W-Cu composite in relative density and conductivity.

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[Zhao Yuchao, Tang Jiancheng, Ye Nan, Zhuo Haiou, Wei Chaolong, Zhou Weiwei. Study on the properties of WC@W-Cu composite prepared by electroplating[J]. Rare Metal Materials and Engineering,2021,50(4):1384~1390.]
DOI:10.12442/j. issn.1002-185X.20200644

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History
  • Received:August 28,2020
  • Revised:November 02,2020
  • Adopted:November 25,2020
  • Online: May 08,2021
  • Published: