EBSD Study on the Recrystallization Behavior of Ni-5Pt Alloy

Abstract:

Nickel-platinum (NiPt) alloy sputtering target is an important raw material in semiconductor industry. Its microstructure characterization and adjustment are of great significance to improve the quality of target and sputtering film. The recrystallization behavior of cold rolled NiPt5 alloy during annealing treatment was investigated by Electron backscatter diffraction (EBSD) analysis system. The results showed that, the major orientation of cold rolled 80% NiPt5 alloy is {112}<021> texture. After annealing at 450℃, the grain nucleation occurred firstly at the deformation zone of <110>∥ND with sub-grain coalescence mechanism. For samples annealed between 550 ℃ to 650 ℃, the average grain size of recrystallized grain structure increased from 1.2 μm to 15 μm and the orientation distribution tended to <110>∥ND; the evolution of HABS and LABS dominated the structure evolution of NiPt5 alloy. For sample annealed at 550℃, the main grain growth mechanism is grain rotation and coalescence. For sample annealed at 650℃, the appearance of a large number of sub-crystals and 60°{111} annealing twins suggested the co-existence of grain rotation and grain boundary migration mechanism.