Intergranular Reaction Mechanism of Submicron-Activated Mo-15Cu Alloy

doi:10.12442/j.issn.1002-185X.20220244

Home > Archive>Volume 52, Issue 2, 2023 >448-453. DOI:10.12442/j.issn.1002-185X.20220244

Intergranular Reaction Mechanism of Submicron-Activated Mo-15Cu Alloy
DOI:
                        10.12442/j.issn.1002-185X.20220244
                    
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Affiliation:1.School of Materials Science and Chemical Engineering, Harbin University of Science and Technology, Harbin 150040, China;2.College of Intelligent Systems Science and Engineering, Harbin Engineering University, Harbin 150006, China
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Fund Project:Project supported by the Reform and Development of Local Colleges and Universities of the Central Government of China (323210001); Project supported by the Harbin Talents of China (2015RAQXJ036)

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Abstract:

In order to investigate the intergranular reaction mechanism during sintering of molybdenum-copper powders with submicron components, a Mo-15Cu composite with an intergranular reaction layer was prepared by a submicron-activated layer method. The histomorphology, connectivity and structural characteristics of Mo-15Cu alloy were characterized by X-ray diffracto-meter (XRD), scanning electron microscope (SEM), energy dispersive spectrometer (EDS), transmission electron microscope (TEM), and high-resolution transmission electron microscope (HRTEM). The effect of submicron-activated layers on the intergranular reaction of Mo-15Cu composites was investigated. The results show that the submicron-activated layer with a thickness of 0.5 μm is formed by adding 8wt% submicron powder. The submicron-sized Mo particles change the intergranular reaction mechanism through flow and diffusion, forming an intergranular reaction layer with a thickness of about 5 nm and achieving metallurgical bonding.

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[Wang Jingze, Yin Jiaqing, Cui Jianwen, Chang Jing, Yu Yandong, Sun Yunlong. Intergranular Reaction Mechanism of Submicron-Activated Mo-15Cu Alloy[J]. Rare Metal Materials and Engineering,2023,52(2):448~453.]
DOI：10.12442/j. issn.1002-185X.20220244

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Received:March 23,2022
Revised:February 08,2023
Adopted:June 17,2022
Online: March 03,2023
Published: February 28,2023

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