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Deformation Behaviors of Pure Tungsten during Equal Channel Double Angular Pressing
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Affiliation:

1.School of Materials Science and Engineering,Hefei University of Technology;2.Tunxi Road,Hefei;3.Institute of Industry and Equipment Technology,Hefei University of Technology

Clc Number:

TG376

Fund Project:

Study on mechanisms of non-equilibrium grain boundary forming and effects on brittleness of porous tungsten deformed by blocking varietal channel angular bi-directional upsetting-extruding with back pressure(51675154).

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    Abstract:

    As a new severe plastic deformation (SPD) method, equal-channel double angular pressing (ECDAP) is developed based on equal-channel angular pressing (ECAP) to reduce the offset load. The deformation behaviors of commercial sintered pure tungsten (W) during single pass ECDAP were analyzed quantitatively in this paper by means of finite element simulation and experiment investigation. The results show that, compared with ECAP, the local force of the die distributes more homogeneously and the offset load of the punch is improved with the same parameters. Meanwhile, the average effective strain introduced by ECDAP is similar to that of ECAP. Nevertheless, the uniformity of strain distribution is also greatly improved owing to the secondary shear deformation. In addition, grain size decreases to 1.77 μm in the secondary shear deformation zone and the grains are elongated obviously in the angle zone. Hence, the microhardness was enhanced because of the Hall-Petch strengthening and strain strengthening. These results indicate that the ECDAP process is a promising approach for producing ultra-fine grains metallic materials.

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[Ping Li, Zi-Hao Duan, Tao Wu, Ya-Ling Hua, Ke-Min Xue. Deformation Behaviors of Pure Tungsten during Equal Channel Double Angular Pressing[J]. Rare Metal Materials and Engineering,2020,49(9):3012~3020.]
DOI:10.12442/j. issn.1002-185X. E20190095

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History
  • Received:July 31,2019
  • Revised:December 24,2019
  • Adopted:February 20,2020
  • Online: October 15,2020
  • Published: