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Characterization of thermal stability of RuMoC films as seedless Cu diffusion barriers in damascene structures for Cu interconnects
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Affiliation:

1.Key Laboratory of Radiation Physics and Technology of Ministry of Education, Institute of Nuclear Science and Technology, Sichuan University;2.Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences;3.Shenzhen Institutes of Advanced Technology Chinese Academy of Sciences;4.State key Laboratory for Mechanical Behavior of Materials, Xi''an Jiaotong University

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Fund Project:

he National Natural Science Foundation of China (Grant11605116), Shenzhen Industry Development Fund Project (Project Nos. JCY20150925163313898 and JCYJ20140417113130693) and Shenzhen Engineering Laboratory Project (No. 2012-1127)

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    Abstract:

    The objective of this study is to test the feasibility of RuMoC films for its application in seedless Cu diffusion barriers of damascene structure. The compatibility with IC fabrication and thermal stability of RuMoC barriers were investigated. The RuMoC barriers were amorphous at temperatures up to 500 ℃, showing great thermal stability. This is because the Ru-C bonds were well preserved at those temperatures, as revealed by XPS results, which hindered the Ru from crystallizing. A Cu plug of good quality was successfully electroplated on RuMoC barriers and filled the trench without seed layer, and the barrier effectively blocked the diffusion of Cu atom at temperatures up to 500 ℃. The results indicated a great prospect of RuMoC film as seedless Cu diffusion barrier in damascene structure for Cu interconnect.

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[Zou Jian Xiong, Lin Li Wei, Jiao Guo Hua, Lu Yuan Fu, Liu Bo, Xu Ke Wei. Characterization of thermal stability of RuMoC films as seedless Cu diffusion barriers in damascene structures for Cu interconnects[J]. Rare Metal Materials and Engineering,2019,48(6):1809~1813.]
DOI:10.12442/j. issn.1002-185X. nm20180066

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History
  • Received:January 18,2018
  • Revised:March 06,2018
  • Adopted:April 10,2018
  • Online: July 30,2019
  • Published: