电子装备高导热石墨烯/铜基复合热沉研究进展

Research Progress on High Thermal Conductivity Graphene/Copper-Based Composite Heat Sinks for Electronic Equipment

摘要:

石墨烯/铜复合热沉凭借高导热、热膨胀系数可调控、高强度及低密度等特性，在军工装备热管理、高功率电子封装、新能源汽车及5G通信等领域具有广泛的应用前景。然而，复杂结构件制备工程中石墨烯与铜分散不均匀、界面结合不良等问题会严重影响石墨烯/铜基复合热沉的综合性能，限制其工程化应用。基于此类问题，总结了石墨烯/铜基复合热沉的制备方法，并对其优缺点进行了分析；综述了石墨烯/铜基复合热沉的均匀分散性、界面结合、作用机制及分子动力学模拟等关键问题，最后展望了石墨烯/铜基复合热沉在工程应用中的发展前景。

Abstract:

Graphene/copper-based composite heat sinks demonstrate extensive application potential in military equipment thermal management, high-power electronic packaging, new energy vehicles, and 5G communication systems, due to their outstanding properties, including high thermal conductivity, tunable thermal expansion coefficients, excellent mechanical strength, and low density. However, the industrial-scale application of these composites faces critical challenges during the fabrication of components with complex structures, such as inhomogeneous dispersion of graphene within the copper matrix and poor interfacial bonding between the two phases, which substantially undermine the overall performance of graphene/copper-based composites. To address these issues, the preparation methods for graphene/copper-based composite heat sinks were reviewed. For each method, a rigorous analysis was presented to clarify its inherent advantages and unavoidable restrictions. Furthermore, the latest research progress in addressing three core scientific challenges was synthesized, including uniform dispersion of graphene, interfacial optimization mechanisms, and molecular dynamics simulations for elucidating the structure-property relationships. Finally, the future development directions of graphene/copper-based composite heat sinks in engineering applications were prospected.