相场模拟在电子封装可靠性中的应用

Application of Phase Field Simulation in Reliability of Electronic Packaging

摘要:

随着电子器件不断向着微型化、集成化和多功能化方向快速发展，芯片封装的复杂性显著提升，封装密度不断增加，焊点尺寸逐渐缩小，电子器件在服役过程中的工作环境愈加严苛，微互连焊点可靠性问题日益突出，焊点失效已成为限制电子封装技术进一步发展的关键瓶颈之一。本文围绕微互连焊点的失效行为，梳理了电子封装中常见的几类可靠性问题，根据选择的相场变量的不同，总结几种常见的相场模拟模型。针对几种常见的可靠性失效模式，如电迁移、硅通孔技术、界面金属间化合物生长等，分析了相场方法在模拟这些失效过程中的应用与发展现状。最后，文章对相场模型在微观失效机制研究中的潜力进行了展望，并探讨其在多物理场耦合、数据驱动建模与工程应用方面的发展趋势。本文旨在为研究微互连焊点失效行为的理论分析和工程实践提供系统参考和方法支持。

Abstract:

With the rapid advancement of electronic devices towards miniaturization, high integration, and multifunctionality, the complexity of chip packaging has increased significantly. As packaging density continues to rise and solder joint size decreases, the operating conditions of electronic components in service become increasingly demanding. Consequently, the reliability of micro-interconnect solder joints has become a critical concern, with solder joint failure emerging as one of the key bottlenecks hindering the further development of electronic packaging techniques. This paper focuses on the failure behavior of micro-interconnect solder joints and reviews several common reliability issues in electronic packaging. Based on the selection of different phase-field variables, several typical phase-field modeling approaches are summarized. Furthermore, the paper analyzes the application and current progress of phase-field methods in simulating several representative failure modes, such as electromigration, through-silicon vias (TSVs), and interfacial intermetallic compound (IMC) growth. Finally, the potential of phase-field modeling in studying micro-scale failure mechanisms is discussed, along with its future development trends in multi-physics coupling, data-driven modeling, and engineering applications. This work aims to provide systematic references and methodological support for both theoretical analysis and practical engineering studies on the failure behavior of micro-interconnect solder joints.