LTCC内电极铜浆组分设计与共烧行为研究进展

Research Progress on Composition Design and Co-firing Behavior of Copper Pastes for LTCC Internal Electrodes

摘要:

随着5G/6G通信和高密度电子封装的发展,低温共烧陶瓷(low-temperature co-fired ceramics,LTCC)器件对高频传输、高密度集成和高可靠服役提出了更高要求。内电极浆料是LTCC多层互连结构的关键材料,其组成与共烧行为直接影响电极的导电性能和服役可靠性。与贵金属电极相比,Cu因成本较低、抗电化学迁移能力较强,逐渐成为LTCC内电极体系的重要发展方向,但其易氧化的特性也增加了材料组分设计和共烧调控的难度。本文围绕LTCC内电极材料由Au、Ag向 Cu演进的技术背景,综述了内电极铜浆中有机载体、无机粘结相和导电相的组分设计进展,重点归纳了其在共烧过程中的抗氧化、烧结致密化、共烧匹配和界面结合行为及影响因素,并概述了当前研究中存在的问题及后续的发展方向。

Abstract:

With the development of 5G/6G communications and high-density electronic packaging, low-temperature co-fired ceramic (LTCC) devices require higher performance in high-frequency signal transmission, high-density integration, and reliable service. Internal electrode paste is a key material in LTCC multilayer interconnect structures, and its composition and co-firing behavior directly affect the electrical conductivity and service reliability of the electrodes. Compared with noble-metal electrodes, Cu is emerging as an important direction for LTCC internal electrodes because of its lower cost and stronger resistance to electrochemical migration. However, its susceptibility to oxidation also increases the difficulty of material composition design and co-firing control. Based on the technical background of the transition of LTCC internal electrode materials from Au and Ag to Cu, this paper reviews the progress in the component design of organic vehicles, inorganic binders, and conductive phases in copper pastes for internal electrodes. It focuses on the oxidation resistance, sintering densification, co-firing compatibility, interfacial bonding behavior, and related influencing factors during co-firing, and further summarizes the current research challenges and future development directions.