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Research on Thermal Deformation Behavior of Mg-Bi Alloys
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1.Xi'an Technological University, Xi'an 710021, China;2.Yulin Yuyang District Dongmei Technology Co., Ltd, Yulin 719000, China

Clc Number:

TG146.22

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    Abstract:

    The extrusion deformation behavior of Mg-3Bi and Mg-6Bi alloys at 400 ℃ and a strain rate of 0.001 s-1 was investigated, and the microstructure characteristics during extrusion were analyzed. Results show that as the Bi content increases from 3wt% to 6wt%, the plasticity of the alloy significantly improves, with the elongation increasing from 2.1% to 5.6%, and the tensile strength increasing from 188.2 MPa to 209.2 MPa. During high temperature extrusion deformation, the dominant softening mechanism of the Mg-3Bi alloy is discontinuous dynamic recrystallization (DDRX), whereas that of the Mg-6Bi alloy involves both DDRX and particle-stimulated nucleation (PSN). In this process, the grain size resulting from DDRX is larger than that produced by PSN. When Mg-Bi alloys are extruded through the die, the strain in the edge region of the die is significantly greater than that in the central region, consequently forming a deformation texture similar to that produced by equal-channel angular pressing (ECAP). Once the accumulated strain reaches a critical value, PSN is initiated. After extrusion deformation, the grains in both edge and central regions of the die exhibit a high degree of recrystallization, with their c-axes perpendicular to the extrusion direction, forming a typical extrusion fiber texture. The ranked contributions to the improvement of mechanical properties of Mg-Bi alloys, in descending order, are grain refinement, dislocation strengthening and nano-phase strengthening mechanisms. Compared with the Mg-3Bi alloy, the dimple density of Mg-6Bi alloy is higher, which disperses stress concentration and consequently enhances plasticity.

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[You Jianwei, Yao Yuhong, Liu Jiangnan, Wang Xinyu, Ren Mengfei. Research on Thermal Deformation Behavior of Mg-Bi Alloys[J]. Rare Metal Materials and Engineering,2026,55(1):241~249.]
DOI:10.12442/j. issn.1002-185X.20250142

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History
  • Received:March 17,2025
  • Revised:May 22,2025
  • Adopted:May 27,2025
  • Online: December 15,2025
  • Published: December 08,2025