Preparation and Water Cooling Verification of Pin-Fin Diamond/Copper Plates for Electronic Packaging

Abstract:

Thermal management in electronic packaging is one of the important technical bottlenecks hindering the development of integrated circuits. Diamond/copper composites have excellent performance in the field of thermal management, but the difficulty in their complex structure formation leads to applications restricted in the field of water cooling in electronic packaging. In this research, the sintering performance between the green body and the composite plate was enhanced by employing a silver doping strategy, thereby addressing the thermal management challenges in electronic packaging. Composite base plates and pin-fin type composite base plates were prepared, and their application benefits were evaluated in both indirect and direct water cooling scenarios. Results demonstrate that the silver-doped copper billet achieves good sintering performance when combined with tungsten-coated diamond/copper composite plates. The composite base plate and the pin-fin type composite base plate effectively reduce the temperature of the heating sheet by 5–6 °C and 4–5 °C during water-cooling tests respectively. The numerical simulation results are in good agreement with the experimental data, confirming the excellent thermal uniformity of the composite structures. This research successfully overcomes the limitations associated with the low thermal conductivity of traditional packaging components and the challenges in fabricating complex structures using diamond/copper composite materials.