1Engineering Research Center of High Performance Copper Alloy Materials and Processing, Ministry of Education, School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;2State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
TG146.23
The National Natural Science Foundation of China (General Program, Key Program, Major Research Plan)
[Yan Siliang, Liu Zilong, Li Junhui, Meng Miao, Huang Liang. Electro-induced Dynamic Globularization Kinetics of TA15 Alloy[J]. Rare Metal Materials and Engineering,2026,55(10):2544~2552.]
DOI:10.12442/j. issn.1002-185X.20250314