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Electro-induced Dynamic Globularization Kinetics of TA15 Alloy
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Affiliation:

1Engineering Research Center of High Performance Copper Alloy Materials and Processing, Ministry of Education, School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;2State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

Clc Number:

TG146.23

Fund Project:

The National Natural Science Foundation of China (General Program, Key Program, Major Research Plan)

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    Abstract:

    The dynamic globularization behavior, law, mechanism, globularization kinetic curve and model of TA15 titanium alloy lamellar structure were studied by pulse current assisted compression test and quantitative analysis of metallographic structure. The results indicate that the increase in current density further aggravates the flow softening phenomenon. The globularization rate increases with the increase in current density and deformation. Based on the Avrami equation, a dynamic electro-induced globularization kinetics model for TA15 alloy is established. The model predicts that the ranges of the critical strain εc for dynamic spheroidization and the strain εf for completing dynamic spheroidization are 0.090–0.187 and 5.02–6.31, respectively, and both decrease with the increase in current density. The globularization kinetics rate increases first and then decreases with the increase in strain and current density. In addition, the higher the current density, the greater the peak value of the spheroidization kinetics rate and the smaller the strain corresponding to the peak value.

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[Yan Siliang, Liu Zilong, Li Junhui, Meng Miao, Huang Liang. Electro-induced Dynamic Globularization Kinetics of TA15 Alloy[J]. Rare Metal Materials and Engineering,2026,55(10):2544~2552.]
DOI:10.12442/j. issn.1002-185X.20250314

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History
  • Received:June 06,2025
  • Revised:July 24,2025
  • Adopted:July 25,2025
  • Online: August 24,2026
  • Published: July 31,2026