Abstract:This study employed a field emission scanning electron microscope, an energy dispersive spectroscope, and ABAQUS finite element analysis to investigate the oxidation behavior of DD6 single-crystal superalloy at a constant temperature of 1000 ℃, focusing on the effects of various processed drilling processes and adjacent hole spacting. The results show that the trend in oxidation mass gain of the DD6 single-crystal superalloy processed by different drilling techniques with different adjacent hole spacting is relatively consistent, following the order: 0.75 mm>0.95 mm>0.55 mm>0.39 mm. Compared with drilling process, adjacent hole spacting emerges as the primary factor affecting oxidation mass gain. The high-temperature oxidation behavior differs between the two drilling processes. The change in microstructure and elemental redistribution in the recast layer produced by electrical discharge machining may cause a variety of elements at different states to react at different rates simultaneously. In contrast, after femtosecond laser processing, there is almost no recast layer on the inner wall of the holes, and the oxide layer forms directly on the single-crystal alloy matrix. Finite element analysis reveals that oxide layer developed on hole surfaces is primarily governed by shedding stress. As adjacent hole spacing increases, the areas of stress cancellation diminish, while shedding stress escalates to a peak under the adjacent hole spacing of 0.75 mm, at which point oxide film shedding is the most pronounced, and then decreases.